CMP Technology’s ‘EE Times’ and TechOnline launch ‘Under the Hood’ for designers working in high-tech

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San Francisco—CMP Technology’s EE Times and TechOnline announced the launch of “Under the Hood,” a print and online editorial program focusing on the challenges faced by electronics engineers who design high-technology products. The program will start Dec. 4, with a special issue distributed in print and online to EE Times’ subscribers throughout the U.S., Europe and Asia. There will also be a special online resource related to the program on TechOnline. "Under the Hood" will launch in mid October.

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