×

Once registered, you can:

  • - Read additional free articles each month
  • - Comment on articles and featured creative work
  • - Get our curated newsletters delivered to your inbox

By registering you agree to our privacy policy, terms & conditions and to receive occasional emails from Ad Age. You may unsubscribe at any time.

Are you a print subscriber? Activate your account.

BtoB

CMP Technology’s ‘EE Times’ and TechOnline launch ‘Under the Hood’ for designers working in high-tech

Published on .

San Francisco—CMP Technology’s EE Times and TechOnline announced the launch of “Under the Hood,” a print and online editorial program focusing on the challenges faced by electronics engineers who design high-technology products. The program will start Dec. 4, with a special issue distributed in print and online to EE Times’ subscribers throughout the U.S., Europe and Asia. There will also be a special online resource related to the program on TechOnline. "Under the Hood" will launch in mid October.

Most Popular
In this article: